· At the highest quality and production levels
· Individual production beyond mass manufacturing
· Use of cutting-edge and complex equipment
Mounting of SMD and THD components
SMD design as of 0201, BGA, μBGA, mounting on FR4, flexible, flex-rigid,
ceramic and metal-core circuit boards
Soldering technology
Reflow-, wave-, robot, vapour phase and selective soldering (also under N2)
Test engineering
Automatic Optical Inspection, in-circuit test, flying probe, boundary scan test
electrical inspection, function test, development and construction of testing equipment
Device assembly
High-quality and cost-efficient assembly service
Other technologies
Automatic varnishing, glueing of components,
moulding technique for single and dual component moulding as well as hot melt, traceability
Production in three-shift system
After Sales Services, repairs
